Job Responsibilities:

1. Comprehensively manage high-power semiconductor laser chips and their packaging products, and provide technical support for other departments of the company in the direction of this product.

2. In-depth participation in the product development and design process, responsible for the test characterization and reliability verification of new products, and responsible for formulating new product specifications and quality control procedures.

3. Lead the process of introducing new products into trial production, and coordinate the materials, manufacturing process, cost accounting and production efficiency guarantee required for mass production. Analyze technical problems found after product testing in a timely manner, and propose solutions.

4. For outsourced products, be responsible for the inspection and review of suppliers, and responsible for all technical matters in the process of cooperation.

5. Analyze customer feedback and needs, and provide answers and countermeasures to product complaints and improvement suggestions.

6. Collect market competitive product information, customer needs, analyze competing products, and assist design engineers in planning new products

7. Assist in the marketing and promotion of the company's products.

job requirements:

1. Bachelor degree or above in optoelectronics, laser physics, optics, semiconductor materials and other related majors. Fresh graduates accepted

2. Have a sense of responsibility, be proactive in work, have a good sense of teamwork and customer service.

3. Have good thinking logic and communication skills.

4. More than one year experience in semiconductor laser TO packaging devices.